TSMC is considering making advanced memory chips and has begun drafting plans for 3D DRAM at Nvidia’s request, The Information reports. It would put TSMC up against Samsung, SK Hynix and Micron as AI demand keeps memory scarce.
TSMC is considering making advanced memory chips, Bloomberg reported on Friday, citing The Information. The move would give the world’s largest chipmaker an even bigger share of the AI hardware supply chain.
TSMC recently began drafting plans to make 3D DRAM, which stacks memory cells vertically to pack in more capacity, at the request of Nvidia, its biggest customer. It could build new factories or buy an existing plant and convert it, Reuters reported, citing The Information.
The work is led by Hsu Kuo-chin, a TSMC vice president who oversees advanced packaging, according to the report. TSMC and Nvidia did not immediately respond to requests for comment.
Memory is in short supply as AI data centres soak it up, sending prices soaring. Micron expects the shortage to last into 2028, and Apple raised Mac and iPad prices in June, citing memory costs. Some customers want their own supply: Elon Musk is planning a $55B chip plant to cut his reliance on Micron.
TSMC is already moving closer to memory. In October, Nvidia reportedly asked Samsung, SK Hynix and Micron to build the base layer of its custom HBM memory on TSMC’s 3nm process. Making DRAM itself would put TSMC up against all three, including SK Hynix, which plans to spend $720B on new plants.
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