Samsung and Broadcom sign $200 billion chip deal spanning memory, foundry and packaging
TL;DR Samsung signs MOU with Broadcom worth more than $200 billion for AI memory, foundry and packaging through 2030 Samsung Electronics and Broadcom have signed a memorandum of understanding worth more than $200 billion spanning memory chips, foundry manufacturing and advanced packaging for artificial intelligence semiconductors. The deal, announced on Friday at an AI summit…